400G QSFP-DD DR4 Optical Transceiver HQSFPDD-1L2 1310nm EML,PIN, 0~70℃

Short Description:


Product Detail

Product Tags

Features

● QSFP-DD MSA rev 5.1 compliant l
● 802.3bs compliant
● QSFP-DD-CMIS-rev4p0
● 400GE DR4 Specification compliant
● 8 x 53.125 Gbit/s PAM4 electrical interface (400GAUI-8)
● Non-hermetic package design
● Maximum power consumption 12 W
● MPO connector
● 425 Gbit/s aggregate bit rate
● Up to 500 m transmission on single mode fiber with FEC
● Operating case temperature: 0℃~70℃l
● Single 3.3 V power supply
● RoHS-2 compliant  

Applications

● Data center network

General Description

HQSFPDD-1L2 is a transceiver module designed for 500 m optical communication applications, and it is compliant with QSFP-DD MSA, IEEE 802.3bs protocol and 400GAUI-8 standards. The 425 Gigabit signal is carried over four parallel lanes by one wavelength per lane. This module can convert 8-channel 53.125 Gbit/s electrical data to 4 parallel channels of optical signals, each supporting 106.25 Gbit/s data transmission. Reversely, it can convert 4-channel 106.25 Gbit/s optical signals to 8-channel electrical output data on the receiver side. It has been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference. The module offers very high functionality and feature integration, accessible via a two-wire serial interface. 

Ordering Information

Part Number Description
HQSFPDD-1L2 QSFP-DD 400G DR4 500Optical Transceiver

General Specifications:

Parameter

Symbol

Min

Typical

Max

Unit

Note

Data rate, each lane

 

 

106.25

 

Gb/s

 

Data rate accuracy

 

-100

 

100

ppm

 

Link distance

D

2

 

500

m

1

Note: 1. G.652 fiber

Absolute Maximum Ratings:

Module performance is not guaranteed and reliability is not implied for any condition that beyond the operating range. Exceeding the limits below may damage the transceiver module permanently.

Parameter

Symbol

Min

Max

Unit

Note

Storage temperature

TST

-40

+85

 

Power supply voltage

VCC

-0.3

+3.6

V

 

Relative humidity

RH

5

85

%

1

Damage threshold per lane

THd

5

 

dBm

 

Note: 1. Non-condensing.

Recommended Operating Conditions:

Parameter

Symbol

Min

Typical

Max

Unit

Note

Operating case temperature

TOP

0

 

70

 

Power supply voltage

VCC

3.135

3.3

3.465

V

 

Note: 1. Non-condensing.

Electrical Characteristics:

Parameter

Symbol

Min

Typical

Max

Unit

Note

Power supply voltage

VCC

3.135

3.3

3.465

V

 

Power supply current

ICC

 

 

3.63

A

 

Power consumption

P

 

 

12

W

 

Transmitter (Module Output)
Differential voltage pk-pk

Vpp

 

 

900

mV

 

Common mode voltage

VCM

-350

 

2850

mV

1

Differential termination

Resistance mismatch

 

 

 

10

%

At 1MHz

Receiver (Module Input)
Overload differential voltage pk-pk 

Vpp

900

 

 

mV

 

Common mode voltage

VCM

-350

 

2850

mV

1

Differential Termination

Resistance Mismatch

 

 

 

10

%

At 1MHz

Note: 1. Vcm is generated by the host. Specification includes effects of ground offset voltage.

Optical Characteristics:

Parameter

Symbol

Min

Typical

Max

Unit

Note

Lane wavelengths

Lc

1304.5

1311

1317.5

nm

 
Transmitter
Average launch power per lane

PAVG

-2.9

 

4

dBm

 

Outer optical modulation amplitude (OMA outer) per lane

POMA

-0.8

 

4.2

dBm

 

Launch power in OMA outer minus TDECQ, each lane

 

-2.2

 

 

dBm

 

Transmitter and dispersion eye closure for PAM4 per lane TDECQ

 

 

3.4

dB

 

Extinction ratio

ER

3.5

 

 

dB

 

Side-mode suppression ratio(SMSR)

SMSR

30

 

 

dB

 

Average launch power OFF transmitter per lane Poff

 

 

-15

dBm

 

Transmitter reflectance  

 

 

-26

dB

 

Optical return loss tolerance

 

 

 

21.4

dB

 

Receiver
Average receiver power per lane

 

-5.9

 

4

dBm

 

Receiver power per lane (OMA)

 

 

 

4.2

dBm

 

Damage threshold per lane

THd

5

 

 

dBm

 

Receiver reflectance

 

 

 

-26

dB

 

LOS assert

LOSA

-15

 

 

dBm

 

LOS de-assert

LOSD

 

 

-8.4

dBm

 

LOS hysteresis

LOSH

0.5

 

 

dB

 

Receiver sensitivity (OMA outer) per lane

Sen

 

 

-4.4

dB

 

Stressed receiver sensitivity(OMA) , each lane

SRS

 

 

-1.9

dBm

 

Conditions of stressed receiver sensitivity test
Stressed eye closure for PAM4,lane under test

SECQ

0.9

 

3.4

dB

 

OMA outer of each aggressor lane

 

 

 

4.2

dBm

 

Digital Diagnostic Monitor Specifications

Digital diagnostic management interface (DDMI) is realized by I2C interface in compliance with CMIS 4.0. Diagnostic management functions are realized, and the data addresses are listed in the form below.

Parameter

Data address

Alarm & Warning

Alarm & Warning

thresholds

Monitor

Module temperature

Lower Page 9

Page2h (128-135)

Lowpage (14-15)

Module voltage

Lower Page 9

Page2h (136-143)

Lowpage (16-17)

Transmitter optical power

Page11h (139 to 142)

Page2h (184-191)

Page11h (170-177)

Bias current

Page11h (143 to 146)

Page2h (176-183)

Page11h (154-161)

Receiver optical power

Page11h (149 to 152)

Page2h (192-199)

Page11h (186-193)

Transceiver Block Diagram

Transceiver Block Diagram1

Figure 1. Transceiver Block Diagram

Pin Definition and Description

The QSFP-DD DR4 module edge connector consists of a single paddle card with 38 pads on the top and 38 pads on the bottom for a total of 76 pads. The pads are defined in such a manner so as to accommodate insertion of a QSFP module into a QSFP-DD receptacle.

Transceiver Block Diagram2

PIN

Logic

Symbol

Description

Note

1

 

GND

Ground

1

2

CML-I

Tx2n

CML-I Transmitter 2 Inverted Data Input

 

3

CML-I

Tx2p

CML-I Transmitter 2 Non-Inverted Data Input

 

4

 

GND

Ground

1

5

CML-I

Tx4n

CML-I Transmitter 4 Inverted Data Input

 

6

CML-I

Tx4p

CML-I Transmitter 4 Non-Inverted Data Input

 

7

 

GND

Ground

1

8

LVTTL-I

ModSelL

LVTLL-I Module Select

 

9

LVTTL-I

ResetL

LVTLL-I Module Reset

 

10

 

VCCRx

+3.3V Power Supply Receiver

2

11

LVCMOS-I/O

SCL

LVCMOS-I/O 2-Wire Serial Interface Clock

 

12

LVCMOS-I/O

SDA

LVCMOS-I/O 2-Wire Serial Interface Data

 

13

 

GND

Ground

1

14

CML-O

Rx3p

CML-O Receiver 3 Non-Inverted Data Output

 

15

CML-O

Rx3n

CML-O Receiver 3 Inverted Data Output

 

16

 

GND

Ground

1

17

CML-O

Rx1p

CML-O Receiver 1 Non-Inverted Data Output

 

18

CML-O

Rx1n

CML-O Receiver 1 Inverted Data Output

 

19

 

GND

Ground

1

20

 

GND

Ground

1

21

CML-O

Rx2n

CML-O Receiver 2 Inverted Data Output

 

22

CML-O

Rx2p

CML-O Receiver 2 Non-Inverted Data Output

 

23

 

GND

Ground

1

24

CML-O

Rx4n

CML-O Receiver 4 Inverted Data Output

 

25

CML-O

Rx4p

CML-O Receiver 4 Non-Inverted Data Output

 

26

 

GND

Ground

1

27

LVTTL-O

ModPrsL

Module Present

 

28

LVTTL-O

IntL

Interrupt

 

29

 

VCCTx

+3.3V Power Supply Transmitter

2

30

 

VCC1

+3.3V Power Supply

2

31

LVTTL-I

LPMode

LVTLL-I Low Power Mode

 

32

 

GND

Ground

1

33

CML-I

Tx3p

CML-I Transmitter 3 Non-Inverted Data Input

 

34

CML-I

Tx3n

CML-I Transmitter 3 Inverted Data Input

 

35

 

GND

Ground

1

36

CML-I

Tx1p

CML-I Transmitter 1 Non-Inverted Data Input

 

37

CML-I

Tx1n

CML-I Transmitter 1 Inverted Data Input

 

38

 

GND

Ground

1

39

 

GND

Ground

1

40

CML-I

Tx6n

CML-I Transmitter 6 Inverted Data Input

 

41

CML-I

Tx6p

CML-I Transmitter 6 Non-Inverted Data Input

 

42

 

GND

Ground

1

43

CML-I

Tx8n

CML-I Transmitter 8 Inverted Data Input

 

44

CML-I

Tx8p

CML-I Transmitter 8 Non-Inverted Data Input

 

45

 

GND

Ground

1

46

 

Reserved

For Future Use, No Connect

 

47

 

VS1

Module Vendor Specific 1, No Connect

 

48

 

VCCRx1

+3.3V Power Supply Receiver

2

49

 

VS2

Module Vendor Specific 2, No Connect

 

50

 

VS3

Module Vendor Specific 3, No Connect

 

51

 

GND

Ground

1

52

CML-O

Rx7p

CML-O Receiver 7 Non-Inverted Data Output

 

53

CML-O

Rx7n

CML-O Receiver 7 Inverted Data Output

 

54

 

GND

Ground

1

55

CML-O

Rx5p

CML-O Receiver 5 Non-Inverted Data Output

 

56

CML-O

Rx5n

CML-O Receiver 5 Inverted Data Output

 

57

 

GND

Ground

1

58

 

GND

Ground

1

59

CML-O

Rx6n

CML-O Receiver 6 Inverted Data Output

 

60

CML-O

Rx6p

CML-O Receiver 6 Non-Inverted Data Output

 

61

 

GND

Ground

1

62

CML-O

Rx8n

CML-O Receiver 8 Inverted Data Output

 

63

CML-O

Rx8p

CML-O Receiver 8 Non-Inverted Data Output

 

64

 

GND

Ground

1

65

 

NC

No Connect

 

66

 

Reserved

For Future Use, No Connect

 

67

 

VCCTx1

+3.3V Power Supply Transmitter

2

68

 

VCC2

+3.3V Power Supply

2

69

 

Reserved

For Future Use, No Connect

 

70

 

GND

Ground

1

71

CML-I

Tx7p

CML-I Transmitter 7 Non-Inverted Data Input

 

72

CML-I

Tx7n

CML-I Transmitter 7 Inverted Data Input

 

73

 

GND

Ground

1

74

CML-I

Tx5p

CML-I Transmitter 5 Non-Inverted Data Input

 

75

CML-I

Tx5n

CML-I Transmitter 5 Inverted Data Input

 

76

 

GND

Ground

1

Notes

1.QSFP-DD uses common ground (GND) for all signals and supply (power). All are common within the QSFP-DD module and all module voltages are referred to this potential unless otherwise noted.Connect these directly to the host board signal-common ground plane.

2. VccRx, VccRx1, Vcc1, Vcc2, VccTx and VccTx1 shall be applied concurrently. VccRx, VccRx1, Vcc1, Vcc2, VccTx and VccTx1 may be internally connected within the module in any combination. Each connector Vcc pin is rated for a maximum current of 1000 mA.

Mechanical Specifications

Transceiver Block Diagram3

Figure 3. Mechanical Dimension (unit in mm)

ESD

This transceiver is specified as ESD threshold 1kV for SFI pins and 2kV for all other electrical input pins, tested per MIL-STD-883, Method 3015.4 /JESD22-A114-A (HBM). However, normal ESD precautions are still required during the handling of this module. This transceiver is shipped in ESD protective packaging. It should be removed from the packaging and handled only in an ESD protected environment.

Laser Safety

This is a Class 1 Laser Product according to EN 60825-1:2014. This product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No. 50, dated (June 24, 2007).

Caution: Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Revision History

Revision Date Description
Preliminary 2022/02/10 Preliminary datasheet

  • Previous:
  • Next:

  • Write your message here and send it to us

    Products categories